Cleaning after removal of BGA

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Cleaning after removal of BGA

SMD TYPE Spatula, which is capable of heating plural pins or lead wires at once, is recommended. * Click icon and jump to each tip shape details

First of all, please apply flux. If not, solder icicle as shown in the left side photo may occur while moving the tip.
	Click here to enlarge the photos.	Click here to enlarge the photos.

Use SMD Type : Shape Spatula

This shape is capable of heating IC lead wires on one side of a wide IC, connector, etc. at once. It offers other recommended usages.

1. Apply flux. (See the movie.) 2. Put the tip on the P.W.B. 3. Move the tip slowly across.