900L-T-2CF Bevel Soldering Tip 5mm/45° x 15mm
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900L-T-2CF Bevel Soldering Tip 5mm/45° x 15mm

SKU: H900L-T-2CF

Hakko
Availability:

Available for order*

Soldering Tip Shape-2C Tinned Surface ONLY For 900L. 934. 908. 914. 952. 959

£6.72 Excl. VAT

Available for order*

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For customers in the Republic of Ireland, please contact us for a quote including shipping and customs charges.

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How to use Shape BC/C and examples

This type has a shape like a cone or column cut at a slant, which allows users to select the cut surface size depending on the workpiece. It is used for drag soldering and pre-tinning of lead wires.

Type F, tinned surface only, is available for Shape BC/C. Try Type F when troubling with excessive solder amount or bridge to neighboring parts. * Not suitable when heavy heat capacity is required.

Difference between BC/C type and BCF/CF type Movie helps you to understand it easily.

 

 Shape BCShape C
DifferenceShapeThis type has a shape like a cone cut at a slant.
This type has a shape like a cone cut at a slant.		This type has a like a column cut at a slant.
This type has a like a column cut at a slant.
Heat capacity
of tip		In Shape BC with its conical shape, the nearer to the base, the thicker the diameter. Therefore, although these types have the same diameter ø1, Shape BC has more heat capacity.
CommonalityHow to select
tip size		Please select the cut surface size depending on the workpiece.

HAKKO Recommendations for Selection of Tip Size (Diameter)

OthersIn case of a chip condenser, we recommend soldering it with Shape BC or C to form ideal solder fillet, which can be hardly formed with Shape B or D.

 

Soldering tiny chip parts such as 0603
Soldering tiny chip parts such as 0603

Put the cut surface to the land.
* Soldering tip in the picture is T13-BCF1 with an N2 system iron for pre-heating effect.

Some IC is specified by manufacturer not to be touched electrode by tip end.

The other tip shapes are recommended.
Soldering tiny chip parts such as 0603

 

Soldering chip parts
Use it for soldering chip part.

Put the cut surface to the land and drag the tip slowly while feeding solder.

Some IC is specified by manufacturer not to be touched electrode by tip end.

 

 

Drag soldering
Use it for drag soldering.

Put the cut surface to the leads and drag it slowly.

Apply flux to leads and land pads before soldering. It prevents the troubles such as solder bridge.

 

 
Use it for drag soldering.

 

 

Pre-tinning lead wire
Use it for pre-tinning lead wire.

Put the cut surface to the lead and drag the tip slowly while feeding solder.

 

 

Point soldering
Use it for point soldering.
1.Put the tip end to the land and the through-hole at one time to heat them.
2.Feed solder to form smooth fillet on the land pad.

 

 

Melting and removing coil coatings
Use it for melting and removing coil coatings.
1.Put the cut surface to the coil and terminal at one time to heat them.
2.Feed solder.

 

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Weight0.01285 kg